Athentek team especially focuses on the 5G mmWave array antenna design in package. We understand the characteristic of the Antenna-in-Package module and the subtle performance variation on various substrates, interconnection, and the key to provide customers the best performance within a small package.
Athentek core technology team understand the characteristic of the highly integrated mmWave antenna, RF components, PCB, and IC within a compact package. The ability to integrate different technologies and complex design into a AiP module will greatly reduce cost and time-to-market for our customers.
Athentek provides an advanced method to test the mmWave AiP module and further low the cost of test with better test coverage. All shipped AiP modules will be pre-tested and pre-qualified. Therefore, it also simplifies test requirements and reduces production test time at OEM/ODM manufacturing level.